合成树fatAdhesive
SyntheticResin sticky 合AgentIt has the largest output, the most varieties, and the most widely used products today. It is also beneficial to the national economyandAdhesives that have the greatest impact on the development of science and technology.
1.ring Oxygen resinAdhesive
Linear polymer compounds containing more than two epoxy groups in their molecular structure are called epoxy resins. The most widely usedPan ringOxygen resin is double PhenolAglycidoletherType–referred to as bisphenolA type epoxy resin. Depending on the ratio of raw materials used in the reaction and the reaction conditions, the average molecular weight of the resin produced is from 340~Varies from 7000. The appearance ranges from viscous liquid to solid resin, with a small average molecular weightyu700, softening point below 50℃is called low molecular weight epoxy resin . Usually epoxy resin adhesives mostly use low molecular weight epoxy resin,and Hot melt adhesive uses polymersQuantityEpoxy resin.
ringOxygenResin Curing Epoxy resin becomes thermosetting resin through three curing reactions.
The activity of epoxy resin in epoxy polymerization reaction is determined by span>yuByether keyincreases due to the presence of epoxy groups, and the epoxy group can easily become polybasic acid and polybasicAcid anhydrides, polyamines and polyphenols, etc., to produce rings: medium temperature curing, with a longer pot life and good cured layer performance. 2-Ethyl-4-Methylamineazole: Medium temperature curing, less toxic.The heat resistance and solvent resistance of the adhesive layer after curingAgentGood performance and easy to use. Pyromellitic acid 二anhydride;High temperature curing，Low toxicity, less heat release during curing process, and high flame resistance.
Toughening agent，Fillers and coupling agents SinglePure ringOxygenResin The properties are relatively brittle after curing. In order to improve the impact resistance and peel strength of the adhesive layer, toughening agents are often added.
Active toughener is involved in the curing of epoxy resin oligomers Reaction. A type of substance with relatively good molecular chain flexibility. Such as polyamide resin with low degree of polymerization, polysulfide rubber and terminal carboxylic acid in rubberscarboxylicKidingNitrileRubber, etc. They function as both toughening agents and curing agents, so after adding this type of toughening agent, The amount of curing agent should be adjusted. Inactive tougheningAgent is notParticipate in the curing reaction, But it is well miscible with epoxy resin. Commonly used are high boiling point liquid esters, such as dibutyl phthalate, phthalic acid Dioctyl ester, etc..
New ringoxy resinAdhesionAgent Develop new types ringOxy resin, is an expanded epoxy resin bondAgentAn important aspect of application, now only multifunctional epoxy resin is introduced—AG-80Adhesive,4.4diaminodiphenylmethylAlkaneGlycidylamine.
This type of resin is in liquid form, with low viscosity, low curing temperature and easy operation. Because there are many active groups in the molecule, the cross-linking density is high after reacting with the curing agent.ResistantGood heat resistance, solvent resistance and alkali resistance, but acid resistance Slightly less sexual.
The structural bonding produced is based on this resinAgentDomesticE-7glue. This glue can bond aluminum, copper, steel and other metal and non-metal materials,Dan can be used at higher temperatures (170~180℃)Maintains dimensional stability and can also be used as a solvent-resistant sealant.
0;font-size: 16px”>An important aspect of application, now only multifunctional epoxy resin is introduced—AG-80Adhesive,4.4diaminodiphenylethylmethylAlkaneGlycidylamine.
This type of resin is in liquid form, low viscosity, low curing temperature, easy to operate. Because there are many active groups in the molecule, after reacting with the curing agent, the cross-linking density is high.resistantGood heat resistance, solvent resistance and alkali resistance, but slightly poor acid resistance.
The structural bonding produced is based on this resinAgentDomesticE-7glue. This glue can bond aluminum, copper, steel and other metal and non-metal materials,Dan can be used at higher temperatures (170~180℃)Maintains dimensional stability and can also be used as a solvent-resistant sealant.
