Rapid quality evaluation and soil remediation effect of potassium pyrophosphate_Industrial additives

Background and overview[1-3]

Potassium pyrophosphate is mainly used in cyanide-free electroplating to replace sodium cyanide as an electroplating complexing agent. It is also used to prepare cleaning agents, detergents, and iron ion removal reagents in bleaching and dyeing; in the food industry, it is used as an emulsifier. agents, chelating agents, tissue improvers, etc. Potassium pyrophosphate contains phosphorus, potassium and other elements that are nutrients for plant growth, and is an environmentally friendly substance for farmland soil.

On March 5, 2019, Health Canada issued document NOM/ADM-0128, revising the list of allowed food additives and approving the use of the food additive potassium pyrophosphate (tetrabasic) in non-standardized foods. After evaluation, Health Canada believes that potassium pyrophosphate is safe as a food additive and allows potassium pyrophosphate to be used as an emulsifier, gelling agent, stabilizer, thickener, pH adjuster, acid-reactive material, and Water calibrators and chelating agents.

Quick quality evaluation[1]Dow reverse osmosis membrane

Hubei Xingfa Chemical Group Co., Ltd. Functional Phosphate Yichang Key Laboratory Low-foaming Surfactant Isomer Alcohol LF901 Fan Jiali et al. used linear scanning voltammetry and chronopotentiometry to measure and draw the cathodic polarization curve and Galvanostatic potential-time curves to study the electrochemical behavior of copper pyrophosphate plating on copper electrodes. The results show that the composition, pH and temperature of the pyrophosphate plating solution will affect the cathodic polarization and galvanostatic potential of the copper electrode plating process. In the plating solution, the mass ratio of pyrophosphate to Cu2+ is 8:1, the concentration of Cu2+ is 0.28~0.39mol/L, and the pH value of the plating solution is When the plating bath temperature is 8.8 to 9.3 and the plating bath temperature is 45 to 48°C, it is beneficial to obtain copper plating with better crystal quality. The greater the cathodic polarization and the more negative the galvanostatic potential, the easier it is for the corresponding plating solution to obtain a dense metal coating, which is consistent with the effect of the Hull cell experiment. The cathodic polarization curve and galvanostatic potential-time curve can be used to quickly evaluate the quality of electroplating grade potassium pyrophosphate.

Leaching and remediation of copper-contaminated soil[3]

Potassium pyrophosphate is an environmentally friendly substance for farmland soil. Wang Mengmeng and others from the School of Environmental Science and Engineering of Guangdong University of Technology studied the elution characteristics of the prepared potassium pyrophosphate eluent for heavy metal copper in simulated contaminated soil through batch oscillation elution experiments. They also discussed the elution time, eluent The influence of pH and potassium pyrophosphate concentration on the elution effect was discussed. The desorption kinetics of copper in soil under the action of potassium pyrophosphate eluent and the change characteristics of heavy metal forms before and after elution were discussed. The results show that the longer the elution time and the greater the eluent concentration, the better the elution effect. The experimental conditions were optimized, leaching and leaching for 24 hours, the pH of the eluent was 7.0, n (potassium pyrophosphate):n (copper) was 7:1, the leaching effect was good, and the copper leaching rate was 40.51%. The copper eluted by potassium pyrophosphate is mainly in the acid-extractable state and the reducible state. The leaching process of soil copper by potassium pyrophosphate eluent conforms to the double constant equation, indicating that the desorption of copper in soil under the action of potassium pyrophosphate eluent is a heterogeneous diffusion process.

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